Epoxy encapsulating compound 100g resin

Brand: AG TermoPasty
Product Code: ART.AGT-223
Availability: Vilnius Store In Stock
Kaunas Store Out of Stock
Central Warehouse Out of Stock
15.30€
Ex Tax: 12.64€

Qty

Two-component resin for potting and encapsulating entire component in electronics, television and radiotechnice. Has very good electrical insulation properties and good adhesion to all materials.

Specification

  • The viscosity at 25 °C: 900 ÷ 1500 [MPa∙s]
  • Density at 20 °C: 1,11 ÷ 1,15 [g/cm3]
  • Mix ratio: 100:10
  • The number of epoxy: minutes. 0,410 [mol/100g]
  • Form: liquid
  • Working temperature: > 110 °C